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常用的單片機體系RAM測驗方法 LED被稱為第四代照明光源或綠色光源，具有節能、環保、壽命長、體積小等特色，能夠廣泛運用于各種指示、顯現、裝飾、背光源、一般照明和城市夜景等范疇。這些年，世界上一些經濟發達國家環繞LED的研制展開了劇烈的技能競賽。
LED microcontroller system RAM test methods commonly used is called the fourth generation light source or green light, energy saving, environmental protection, long life, small size and other characteristics, can be widely used in various directions, display, decoration, backlight, general lighting and city lights etc.. Over the years, some of the world's developed countries around the development of LED launched a fierce skills competition.
出光率決議LED光源運用程度
The light output rate is used to determine the LED light source
LED燈具與傳統燈具有完全不一樣的構造，并且構造對發揮其特性有著關健效果，現代LED燈具首要由LED光源、光學體系、驅動性器、散熱器、規范燈具接口等五有些構成。
LED lamp with the traditional lamp structure is completely different, and the structure is Guan Jian effect to play its characteristics, modern LED lamps mainly by LED light source, optical system, radiator, lamps, driving organ specification interface five some form.
德國量一的芯片內經過在硅膠中摻入納米熒光粉可使折射率進步到1.8以上，下降光散射，進步LED出光功率并有用改進了光色質量。一般熒光粉尺度在1um 以上折射率大于或等于1.85，而硅膠折射率一般為1.5左右，因為兩者同折射率的不匹配以及熒光粉顆粒尺度遠大于光散射極限(30 nm)，因而熒光粉顆粒外表存在光散射，下降了出光率。
Germany, the amount of a chip in the silica gel after the incorporation of nano phosphors can make the refractive index increased to more than 1.8, decreased light scattering, improve the LED out of power and improve the quality of light and color. The general fluorescent powder scale in the 1um above the refractive index is greater than or equal to 1.85, and the refractive index of silica gel is generally around 1.5, because both refractive index mismatch and phosphor particle size is much larger than the optical scattering limit (30 nm), the phosphor particles are surface light scattering, reduced light rate.
現在白光LED首要經過三種方法完成：
White LED is now basically completed in three ways:
1、選用紅、綠、藍三色LED組合發光即多芯片白光LED；
1, the use of red, green, blue color LED combination light-emitting multi chip white LED;
2、選用藍光LED芯片和$熒光粉，由藍光和黃光兩色互補得到白光或用藍光LED芯片合作赤色和綠色熒光粉，由芯片宣布的藍光、熒光粉宣布的紅光和綠光三色混合取得白光；
2, the blue LED chip and $phosphor by the blue light and yellow and white or white with blue are complementary LED chip Cooperation red and green fluorescent powder, blue phosphor powder, announced by the chip announced the red and green colors have mixed white light;
3、運用紫外LED芯片宣布的近紫外激起三基色熒光粉得到白光。
3, the use of ultraviolet LED chip announced near UV excitation of three primary phosphor to get white light.
現在運用廣泛的是第二種方法，選用藍光LED芯片和熒光粉，互補得到白光。因而，此種芯片進步LED的流明功率，決議于藍光芯片的初始光通量及光堅持率。
Now widely used are second methods, the use of blue chip LED and fluorescent powder, complementary to get white light. As a result, this chip improves the lumen power of LED, which is determined by the initial luminous flux and optical adherence rate of the blue chip.
而藍光LED芯片的初始光通量是隨著外延及襯底技能發展而進步的。光通堅持率則光經過封裝技能進行堅持的，堅持光通堅持率的要害在于改進導電及散熱內環境，這就涉及到LED封裝的要害技能：低熱阻封裝技術和高取光率封裝構造與技術。
The initial luminous flux of blue chip LED is developed with the development of epitaxy and substrate technology. The rate of light flux adhere to the package through skills to adhere to, adhere to adhere to the key is to improve the luminous flux rate of conductive and heat dissipation in the environment, which involves the key skills of LED packaging: packaging technology and low thermal resistance and high light taking rate packaging structure and technology.
就現在來講，現有LED光效水平，因為輸入電能的80%轉化為熱量，因而芯片散熱熱量非常要害。LED封裝熱阻首要包含資料內部熱阻和界面熱阻。散熱基極的效果首要是吸收芯片發生的熱量，并傳導到熱阻上，完成與外界的熱交換；而削減界面和界面觸摸熱阻，增強散熱也是要害，因而芯片和散熱基極的熱界面資料挑選非常重要，現在選用低溫或共晶焊膏或銀膠。德國量一照明運用的LED芯片內運用的導熱膠是內摻納米顆粒的導熱膠，有用進步了界面傳熱，削減了界面熱阻，加快了LED芯片的散熱。
For now, the existing LED light efficiency level, because the input of 80% of the energy into heat, so the chip heat dissipation is very important. LED package thermal resistance mainly includes internal thermal resistance and interface thermal resistance. The effect of heat absorption is the main base of chip heat conduction to heat resistance, complete heat exchange with the outside world; and cut the interface and interface thermal resistance, enhanced heat dissipation is crucial, so the chip and radiating base thermal interface material selection is very important, now selected by low temperature or eutectic solder paste or silver glue. The amount of heat conduction glue used in the LED chip is a kind of heat conductive adhesive which is mixed with nano particles, which can improve the interface heat transfer, reduce the interface thermal resistance and accelerate the cooling of the LED chip.
在LED運用過程中，輻射復合發生的光子在向外發射時發生的丟失，首要有三個方面：
In the process of using LED, the loss of the photons emitted by the radiative recombination occurs in the outward emission, which has three aspects:
1、芯片內部構造缺點以及資料的吸收，光子在出射界面因為折射率差導致的反射丟失；
1, the internal structure of the chip, as well as the absorption of the data, photons in the exit interface because of the refractive index difference caused by the loss of reflection;
2、因為入射角大于全反射臨界角而引出的全反射丟失；
2, because the incident angle is greater than the total reflection critical angle, the total reflection loss;
3、經過在芯片外表掩蓋一層折射率相對較高的透明膠層有用削減光子在界面的丟失，進步了取光率。
3, after the mask in the chip to cover a relatively high refractive index of the transparent layer to reduce the loss of photons in the interface, improve the light extraction rate.
因而請求其有透光率高，折射率高，熱穩定性好，流動性好，易于噴涂，同是為進步LED封裝的可靠性它請求具有低吸濕性，低應力耐老化等特性。并且一般白光LED還需要芯片所發的藍光激起熒光粉合成發光，在封裝膠內還需參加熒光粉進行配比混色，因而熒光粉的激起功率和變換功率是高光效的要害。
Therefore, the utility model has the advantages of high light transmittance, high refractive index, good thermal stability, good fluidity and easy spraying. The utility model is used for improving the reliability of the LED package. And the general white LED also required the blue chip bioluminescent synthesis of fluorescent powder, the packaging adhesive also need to participate in the fluorescent powder ratio and color mixing, fluorescent powder stirred power and high efficiency is the key power transform.

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